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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Memory Width | 1 |
| JESD-609 Code | e3 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Terminal Position | DUAL |
| Supply Voltage | 3.3V |
| Packaging | Tray |
| Factory Lead Time | 10 Weeks |
| Ambient Temperature Range High | 85°C |
| Published | 2011 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Operating Supply Voltage | 3V |
| Terminal Finish | Tin (Sn) |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Memory Format | FLASH |
| Number of Terminations | 48 |
| Number of Pins | 48 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Memory Interface | Parallel |
| Height | 1.2mm |
| Memory Type | Non-Volatile |
| Width | 12mm |
| Voltage – Supply | 2.7V~3.6V |
| Operating Mode | ASYNCHRONOUS |
| HTS Code | 8542.32.00.51 |
| Write Cycle Time – Word, Page | 25ns |
| Length | 18.4mm |
| ECCN Code | 3A991.B.1.A |
| Technology | FLASH – NAND (SLC) |
| Package / Case | 48-TFSOP (0.724, 18.40mm Width) |
| Page Size | 256B |
| Memory Size | 2Gb 256M x 8 |
| Density | 2 Gb |
| Organization | 2GX1 |
*The following components have specifications similar
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