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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Packaging | Bulk |
| Mounting Type | Through Hole |
| Mount | Through Hole |
| Number of Functions | 1 |
| Number of Outputs | 1 |
| ECCN Code | EAR99 |
| RoHS Status | Non-RoHS Compliant |
| Trim/Adjustable Output | YES |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Terminal Position | DUAL |
| Published | 2013 |
| Pbfree Code | no |
| Qualification Status | Not Qualified |
| JESD-609 Code | e0 |
| Voltage – Input (Max) | 60V |
| Applications | ITE (Commercial) |
| Type | Isolated Module |
| Number of Terminations | 9 |
| Voltage – Isolation | 3kV |
| Input Voltage-Nom | 48V |
| Voltage – Output 1 | 48V |
| Output Voltage | 48V |
| Technology | HYBRID |
| Voltage – Input (Min) | 42V |
| Terminal Form | PIN/PEG |
| Efficiency | 90% |
| Package / Case | Full Brick |
| Feature | OCP, OTP, OVP, SCP |
| JESD-30 Code | R-XDMA-P9 |
| Operating Temperature | -55°C~85°C |
| Height | 20.066mm |
| Terminal Finish | TIN LEAD OVER COPPER |
| Power (Watts) | 200W |
| Max Power Dissipation | 200W |
| Approval Agency | UL; CE; VDE; CSA; TUV; BABT |
| Size / Dimension | 4.60Lx1.86W x 0.79 H 116.8mmx47.2mmx20.1mm |
| Protections | THERMAL; CURRENT; OUTPUT OVER VOLTAGE |
| Max Output Current | 4.17A |
| Series | VI-200? (200W) |
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