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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Memory Width | 1 |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Lead Free | Lead Free |
| Number of Terminations | 8 |
| Terminal Position | DUAL |
| Factory Lead Time | 6 Weeks |
| Packaging | Tray |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 3V |
| Programming Voltage | 3V |
| Published | 2014 |
| Terminal Pitch | 1.27mm |
| Operating Temperature | -40°C~85°C TA |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Height Seated (Max) | 0.8mm |
| Width | 6mm |
| Memory Type | Non-Volatile |
| Interface | SPI |
| Length | 8mm |
| Terminal Finish | Matte Tin (Sn) – annealed |
| Voltage – Supply | 2.7V~3.6V |
| Screening Level | TS 16949 |
| Parallel/Serial | SERIAL |
| Operating Mode | SYNCHRONOUS |
| Package / Case | 8-WDFN Exposed Pad |
| Memory Interface | SPI – Quad I/O |
| JESD-30 Code | R-PDSO-N8 |
| Clock Frequency | 104MHz |
| Memory Density | 67108864 bit |
| Memory Size | 64Mb 8M x 8 |
| Write Cycle Time – Word, Page | 1.5ms |
| Series | SST26 SQI? |
| Organization | 64MX1 |
| Base Part Number | SST26VF064 |
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