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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Surface Mount | YES |
| Packaging | Tray |
| Qualification Status | Not Qualified |
| Memory Width | 16 |
| Factory Lead Time | 16 Weeks |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 1.8V |
| Power Supplies | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Height Seated (Max) | 1mm |
| Terminal Position | BOTTOM |
| Memory Interface | Parallel |
| Memory Type | Non-Volatile |
| Length | 8mm |
| Width | 8mm |
| Supply Voltage-Min (Vsup) | 1.7V |
| Operating Mode | SYNCHRONOUS |
| HTS Code | 8542.32.00.51 |
| Supply Voltage-Max (Vsup) | 1.95V |
| ECCN Code | 3A991.B.1.A |
| Voltage – Supply | 1.7V~1.95V |
| Clock Frequency | 108MHz |
| Memory Density | 268435456 bit |
| Number of Terminations | 133 |
| Organization | 16MX16 |
| Subcategory | Other Memory ICs |
| Memory Format | FLASH, RAM |
| Technology | FLASH, DRAM |
| Package / Case | 133-VFBGA |
| Series | XS-R |
| Memory Size | 256Mbit Flash 2565Mbit DDR DRAM |
| JESD-30 Code | S-PBGA-B133 |
*The following components have specifications similar
*The following five components have specifications similar
