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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Radiation Hardening | No |
| Surface Mount | YES |
| Part Status | Obsolete |
| Alternate Memory Width | 8 |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Packaging | Tray |
| Published | 2016 |
| JESD-609 Code | e0 |
| Memory Width | 16 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage-Min (Vsup) | 3V |
| Programming Voltage | 3V |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 1mm |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Number of Terminations | 64 |
| Number of Pins | 64 |
| Memory Interface | Parallel |
| Peak Reflow Temperature (Cel) | 240 |
| Terminal Finish | TIN LEAD |
| Height Seated (Max) | 1.4mm |
| Memory Type | Non-Volatile |
| Voltage – Supply | 3V~3.6V |
| Width | 11mm |
| Length | 13mm |
| Technology | FLASH – NOR |
| HTS Code | 8542.32.00.71 |
| Package / Case | 64-LBGA |
| Access Time | 110ns |
| Series | GL-P |
| Density | 2 Gb |
| Organization | 256MX16 |
| Memory Size | 2Gb 256M x 8 128M x 16 |
*The following components have specifications similar
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