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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Mounting Type | Surface Mount |
Number of Functions | 1 |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |
Surface Mount | YES |
Data Polling | YES |
Toggle Bit | YES |
Ready/Busy | YES |
Part Status | Obsolete |
Packaging | Tray |
Memory Width | 16 |
Peak Reflow Temperature (Cel) | 260 |
Published | 2015 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 40 |
Supply Voltage | 1.8V |
Operating Supply Voltage | 1.8V |
Height Seated (Max) | 1mm |
Memory Format | FLASH |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
JESD-609 Code | e1 |
Memory Type | Non-Volatile |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Supply Voltage-Min (Vsup) | 1.7V |
Number of Terminations | 84 |
Number of Pins | 84 |
Technology | FLASH – NOR |
Clock Frequency | 66MHz |
HTS Code | 8542.32.00.51 |
Supply Voltage-Max (Vsup) | 1.95V |
Write Cycle Time – Word, Page | 60ns |
Standby Current-Max | 0.000005A |
Operating Temperature | -25°C~85°C TA |
ECCN Code | 3A991.B.1.A |
Supply Current-Max | 0.08mA |
Voltage – Supply | 1.7V~1.95V |
Interface | Parallel, Serial |
Length | 11.6mm |
Access Time | 80ns |
Density | 128 Mb |
Memory Size | 128Mb 8M x 16 |
Organization | 8MX16 |
Boot Block | BOTTOM/TOP |
Sector Size | 16K64K |
Address Bus Width | 23b |
Page Size | 8words |
Package / Case | 84-VFBGA |
Number of Sectors/Size | 8126 |
Series | WS-P |
*The following components have specifications similar
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