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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Mount | Surface Mount |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Radiation Hardening | No |
| JESD-609 Code | e3 |
| Memory Width | 8 |
| Moisture Sensitivity Level (MSL) | 3 |
| Min Operating Temperature | -40°C |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 85°C |
| Terminal Finish | Matte Tin (Sn) |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Supply Voltage | 1.8V |
| Operating Supply Voltage | 1.8V |
| Terminal Pitch | 0.5mm |
| Height Seated (Max) | 1mm |
| Temperature Grade | INDUSTRIAL |
| Number of Terminations | 44 |
| Number of Pins | 44 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Nominal Supply Current | 60mA |
| Min Supply Voltage | 1.7V |
| Data Bus Width | 16b |
| Word Size | 16b |
| Sync/Async | Asynchronous |
| HTS Code | 8542.32.00.51 |
| Package / Case | FBGA |
| Max Supply Voltage | 1.95V |
| ECCN Code | 3A991.B.1.A |
| Access Time | 80 ns |
| Length | 7.7mm |
| Frequency | 108MHz |
| Frequency (Max) | 108MHz |
| Interface | Parallel, Serial |
| Address Bus Width | 24b |
| Density | 256 Mb |
| Memory Size | 32MB |
| Additional Feature | BOTTOM BOOT BLOCK |
| Organization | 32MX8 |
| Memory Type | FLASH, NOR |
*The following components have specifications similar
*The following five components have specifications similar
