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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Radiation Hardening | No |
Surface Mount | YES |
Command User Interface | YES |
Data Polling | YES |
Toggle Bit | YES |
Ready/Busy | YES |
Common Flash Interface | YES |
Part Status | Obsolete |
Packaging | Tray |
Memory Width | 16 |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 40 |
Supply Voltage | 3V |
Programming Voltage | 3V |
Factory Lead Time | 9 Weeks |
Operating Temperature | -40°C~85°C TA |
Height Seated (Max) | 1mm |
Memory Format | FLASH |
Supply Voltage-Max (Vsup) | 3.6V |
Terminal Position | BOTTOM |
Number of Terminations | 80 |
Number of Pins | 80 |
Supply Voltage-Min (Vsup) | 2.7V |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
JESD-609 Code | e1 |
Memory Type | Non-Volatile |
Length | 11mm |
Voltage – Supply | 2.7V~3.6V |
Technology | FLASH – NOR |
HTS Code | 8542.32.00.51 |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Power Supplies | 3/3.3V |
Access Time (Max) | 60 ns |
Write Cycle Time – Word, Page | 60ns |
Standby Current-Max | 0.000005A |
ECCN Code | 3A991.B.1.A |
Supply Current-Max | 0.07mA |
Density | 128 Mb |
Memory Size | 128Mb 8M x 16 |
Organization | 8MX16 |
Boot Block | BOTTOM/TOP |
Package / Case | 80-VFBGA |
Sector Size | 4K32K |
Address Bus Width | 23b |
Page Size | 8words |
Series | PL-J |
Additional Feature | TOP AND BOTTOM BOOT BLOCK |
Number of Sectors/Size | 16254 |
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