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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Surface Mount | YES |
| Memory Width | 8 |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 3V |
| Programming Voltage | 3V |
| Factory Lead Time | 13 Weeks |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 1mm |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Number of Terminations | 64 |
| Supply Voltage-Min (Vsup) | 2.7V |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Height Seated (Max) | 1.4mm |
| Memory Type | Non-Volatile |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Width | 11mm |
| Voltage – Supply | 2.7V~3.6V |
| Screening Level | AEC-Q100 |
| Length | 13mm |
| Operating Mode | ASYNCHRONOUS |
| Technology | FLASH – NOR |
| HTS Code | 8542.32.00.51 |
| Write Cycle Time – Word, Page | 60ns |
| Access Time | 90ns |
| Package / Case | 64-LBGA |
| Memory Density | 268435456 bit |
| Memory Size | 256Mb 16M x 16 |
| Series | GL-S |
| JESD-30 Code | R-PBGA-B64 |
| Organization | 32MX8 |
*The following components have specifications similar
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