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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Packaging | Tape & Reel (TR) |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
Surface Mount | YES |
Part Status | Obsolete |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Alternate Memory Width | 8 |
Operating Temperature (Min) | -40°C |
Memory Width | 16 |
Technology | CMOS |
Operating Temperature (Max) | 85°C |
Supply Voltage | 3V |
Programming Voltage | 3V |
Moisture Sensitivity Level (MSL) | Vendor Undefined |
Reach Compliance Code | compliant |
Terminal Pitch | 1mm |
Memory IC Type | FLASH |
Temperature Grade | INDUSTRIAL |
Supply Voltage-Max (Vsup) | 3.6V |
Terminal Position | BOTTOM |
Number of Terminations | 64 |
Supply Voltage-Min (Vsup) | 2.7V |
Terminal Form | BALL |
JESD-609 Code | e1 |
Height Seated (Max) | 1.4mm |
Width | 11mm |
Length | 13mm |
Parallel/Serial | PARALLEL |
Operating Mode | ASYNCHRONOUS |
HTS Code | 8542.32.00.51 |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Access Time (Max) | 100 ns |
Memory Density | 134217728 bit |
Organization | 8MX16 |
JESD-30 Code | R-PBGA-B64 |
*The following components have specifications similar
*The following five components have specifications similar