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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Alternate Memory Width | 2 |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Memory Width | 4 |
| Packaging | Tray |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 3V |
| Programming Voltage | 3V |
| Factory Lead Time | 13 Weeks |
| Number of Terminations | 24 |
| Terminal Pitch | 1mm |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Supply Voltage-Min (Vsup) | 2.7V |
| Height Seated (Max) | 1.2mm |
| JESD-609 Code | e1 |
| Width | 6mm |
| Operating Temperature | -40°C~125°C TA |
| Memory Type | Non-Volatile |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Length | 8mm |
| Voltage – Supply | 2.7V~3.6V |
| Parallel/Serial | SERIAL |
| Operating Mode | SYNCHRONOUS |
| Technology | FLASH – NOR |
| Clock Frequency | 108MHz |
| Package / Case | 24-TBGA |
| Memory Density | 67108864 bit |
| Memory Interface | SPI – Quad I/O, QPI |
| Memory Size | 64Mb 8M x 8 |
| JESD-30 Code | R-PBGA-B24 |
| Organization | 16MX4 |
| Series | FL-L |
| Additional Feature | IT ALSO HAVE X1 MEMORY WIDTH |
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