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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Number of Elements2
Mounting TypeSurface Mount
PackagingTape & Reel (TR)
Radiation HardeningNo
Surface MountYES
JESD-609 Codee3
Lead FreeLead Free
Number of Terminations6
Number of Pins6
Pin Count6
Published2011
Factory Lead Time4 Weeks
Element ConfigurationDual
Max Power Dissipation500mW
Power – Max500mW
Terminal FinishTin (Sn)
Transistor Element MaterialSILICON
Max Dual Supply Voltage20V
Drain to Source Breakdown Voltage20V
Operating Temperature-55°C~150°C TJ
Terminal FormFLAT
Transistor ApplicationSWITCHING
Operating ModeENHANCEMENT MODE
Gate to Source Voltage (Vgs)8V
Continuous Drain Current (ID)800mA
FET TechnologyMETAL-OXIDE SEMICONDUCTOR
Turn On Delay Time6 ns
FET FeatureLogic Level Gate
FET Type2 N-Channel (Dual)
Rise Time4ns
Package / CaseSOT-563, SOT-666
Drain Current-Max (Abs) (ID)0.8A
Fall Time (Typ)31 ns
SeriesAutomotive, AEC-Q101, TrenchMOS?
Power Dissipation390mW
Vgs(th) (Max) @ Id950mV @ 250μA
Drain-source On Resistance-Max0.38Ohm
Turn-Off Delay Time86 ns
Gate Charge (Qg) (Max) @ Vgs0.68nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds83pF @ 10V
Rds On (Max) @ Id, Vgs380m Ω @ 500mA, 4.5V

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