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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Elements | 2 |
Mounting Type | Surface Mount |
Packaging | Tape & Reel (TR) |
Radiation Hardening | No |
Surface Mount | YES |
JESD-609 Code | e3 |
Lead Free | Lead Free |
Number of Terminations | 6 |
Number of Pins | 6 |
Pin Count | 6 |
Published | 2011 |
Factory Lead Time | 4 Weeks |
Element Configuration | Dual |
Max Power Dissipation | 500mW |
Power – Max | 500mW |
Terminal Finish | Tin (Sn) |
Transistor Element Material | SILICON |
Max Dual Supply Voltage | 20V |
Drain to Source Breakdown Voltage | 20V |
Operating Temperature | -55°C~150°C TJ |
Terminal Form | FLAT |
Transistor Application | SWITCHING |
Operating Mode | ENHANCEMENT MODE |
Gate to Source Voltage (Vgs) | 8V |
Continuous Drain Current (ID) | 800mA |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
Turn On Delay Time | 6 ns |
FET Feature | Logic Level Gate |
FET Type | 2 N-Channel (Dual) |
Rise Time | 4ns |
Package / Case | SOT-563, SOT-666 |
Drain Current-Max (Abs) (ID) | 0.8A |
Fall Time (Typ) | 31 ns |
Series | Automotive, AEC-Q101, TrenchMOS? |
Power Dissipation | 390mW |
Vgs(th) (Max) @ Id | 950mV @ 250μA |
Drain-source On Resistance-Max | 0.38Ohm |
Turn-Off Delay Time | 86 ns |
Gate Charge (Qg) (Max) @ Vgs | 0.68nC @ 4.5V |
Input Capacitance (Ciss) (Max) @ Vds | 83pF @ 10V |
Rds On (Max) @ Id, Vgs | 380m Ω @ 500mA, 4.5V |
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