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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Toggle Bit | NO |
| Data Polling | NO |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Radiation Hardening | No |
| Surface Mount | YES |
| Part Status | Obsolete |
| Packaging | Tray |
| REACH SVHC | No SVHC |
| Peak Reflow Temperature (Cel) | 260 |
| Published | 2011 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 3V |
| Memory Format | FLASH |
| Terminal Position | BOTTOM |
| Number of Terminations | 64 |
| Number of Pins | 64 |
| Memory Interface | Parallel |
| Height | 1.2mm |
| JESD-609 Code | e1 |
| Memory Type | Non-Volatile |
| Nominal Supply Current | 31mA |
| Contact Plating | Copper, Silver, Tin |
| Word Size | 16b |
| Voltage | 2.3V |
| Sync/Async | Asynchronous |
| Technology | FLASH – NOR |
| Power Supplies | 2.5/3.3V |
| Terminal Finish | TIN SILVER COPPER |
| Voltage – Supply | 2.3V~3.6V |
| Length | 10.1mm |
| Operating Temperature | -40°C~85°C TC |
| Clock Frequency | 52MHz |
| Width | 8.1mm |
| Interface | Parallel, Serial |
| Boot Block | TOP |
| Memory Size | 256Mb 16M x 16 |
| Address Bus Width | 24b |
| Organization | 16MX16 |
| Density | 256 Mb |
| Access Time (Max) | 95 ns |
| Package / Case | 64-TBGA |
| Write Cycle Time – Word, Page | 95ns |
| Series | Axcell? |
| Number of Sectors/Size | 4255 |
| Standby Current-Max | 0.00021A |
| Base Part Number | 28F256P33 |
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