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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Toggle Bit | NO |
Data Polling | NO |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Number of Functions | 1 |
Radiation Hardening | No |
Command User Interface | YES |
Ready/Busy | YES |
Part Status | Obsolete |
Memory Width | 8 |
Packaging | Tray |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Supply Voltage | 3V |
Voltage – Rated DC | 3V |
Voltage | 3V |
Operating Temperature | -40°C~85°C TA |
Memory Format | FLASH |
Terminal Position | BOTTOM |
Published | 2004 |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
Nominal Supply Current | 20mA |
Memory Type | Non-Volatile |
Word Size | 8b |
Length | 11mm |
JESD-609 Code | e2 |
Voltage – Supply | 2.7V~3.6V |
Sync/Async | Asynchronous |
Access Time (Max) | 35 ns |
HTS Code | 8542.32.00.51 |
Height Seated (Max) | 1.05mm |
Number of Terminations | 63 |
Number of Pins | 63 |
Write Cycle Time – Word, Page | 50ns |
Technology | FLASH – NAND |
ECCN Code | 3A991.B.1.A |
Page Size | 512B |
Standby Current-Max | 0.00005A |
Memory Size | 512Mb 64M x 8 |
Number of Sectors/Size | 4K |
Density | 512 Mb |
Address Bus Width | 26b |
Organization | 64MX8 |
Sector Size | 16K |
Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
Package / Case | 63-TFBGA |
Base Part Number | NAND512 |
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