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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Part Status | Obsolete |
| Memory Width | 8 |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Ambient Temperature Range High | 85°C |
| Published | 2011 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 1.8V |
| Operating Supply Voltage | 1.8V |
| Voltage | 1.8V |
| Voltage – Rated DC | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Memory Format | FLASH |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Memory Type | Non-Volatile |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Word Size | 8b |
| Length | 11mm |
| Nominal Supply Current | 15mA |
| Contact Plating | Copper, Silver, Tin |
| Sync/Async | Asynchronous |
| HTS Code | 8542.32.00.51 |
| Height | 1.05mm |
| Number of Terminations | 63 |
| Number of Pins | 63 |
| Pin Count | 63 |
| Write Cycle Time – Word, Page | 50ns |
| Technology | FLASH – NAND |
| ECCN Code | 3A991.B.1.A |
| Voltage – Supply | 1.7V~1.95V |
| Page Size | 512B |
| Memory Size | 512Mb 64M x 8 |
| Density | 512 Mb |
| Address Bus Width | 26b |
| Organization | 64MX8 |
| Package / Case | 63-TFBGA |
| Base Part Number | NAND512 |
*The following components have specifications similar
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