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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Lead Free | Lead Free |
| Memory Width | 8 |
| Packaging | Tray |
| Operating Temperature (Min) | -40°C |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Operating Temperature (Max) | 85°C |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Published | 2014 |
| Supply Voltage | 1.8V |
| Programming Voltage | 1.8V |
| Height Seated (Max) | 1mm |
| Part Status | Not For New Designs |
| Memory IC Type | FLASH |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Width | 9mm |
| Length | 11mm |
| Supply Voltage-Min (Vsup) | 1.7V |
| Parallel/Serial | PARALLEL |
| Operating Mode | ASYNCHRONOUS |
| HTS Code | 8542.32.00.51 |
| Number of Terminations | 63 |
| Supply Voltage-Max (Vsup) | 1.95V |
| ECCN Code | 3A991.B.1.A |
| Memory Density | 4294967296 bit |
| Organization | 512MX8 |
| JESD-30 Code | R-PBGA-B63 |
*The following components have specifications similar
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