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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Alternate Memory Width | 2 |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Terminations | 8 |
| Memory Width | 4 |
| Factory Lead Time | 10 Weeks |
| Supply Voltage | 1.8V |
| Programming Voltage | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 2V |
| Terminal Position | BOTTOM |
| Published | 2017 |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Clock Frequency | 80MHz |
| Interface | SPI, Serial |
| Operating Mode | SYNCHRONOUS |
| Technology | FLASH – NOR |
| Supply Voltage-Min (Vsup) | 1.65V |
| HTS Code | 8542.32.00.51 |
| Height Seated (Max) | 0.45mm |
| Memory Density | 8388608 bit |
| Memory Size | 8Mb 1M x 8 |
| Voltage – Supply | 1.65V~2V |
| Series | MXSMIO? |
| JESD-30 Code | R-PBGA-B8 |
| Package / Case | 8-XFBGA, WLCSP |
| Write Cycle Time – Word, Page | 30μs, 3ms |
| Organization | 2MX4 |
| Additional Feature | ALSO IT CAN BE CONFIGURED AS 8M X 1 BIT |
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