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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Memory Width | 8 |
| Alternate Memory Width | 4 |
| Packaging | Tray |
| Factory Lead Time | 10 Weeks |
| Operating Temperature (Min) | -40°C |
| Technology | CMOS |
| Operating Temperature (Max) | 85°C |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 1.8V |
| Programming Voltage | 1.8V |
| Number of Terminations | 24 |
| Terminal Pitch | 1mm |
| Memory IC Type | FLASH |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Max (Vsup) | 2V |
| Terminal Position | BOTTOM |
| Height Seated (Max) | 1.2mm |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Width | 6mm |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Length | 8mm |
| Parallel/Serial | SERIAL |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 166MHz |
| Supply Voltage-Min (Vsup) | 1.65V |
| Memory Density | 268435456 bit |
| JESD-30 Code | R-PBGA-B24 |
| Memory Size | 32MB |
| Organization | 32MX8 |
| Additional Feature | IT CAN ALSO BE CONFIGURED AS 128M X 2 AND 256M X 1 |
*The following components have specifications similar
*The following five components have specifications similar
