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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Alternate Memory Width | 2 |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Factory Lead Time | 12 Weeks |
| Memory Width | 4 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Temperature (Min) | -40°C |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Operating Temperature (Max) | 85°C |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Programming Voltage | 3V |
| Supply Voltage | 1.8V |
| Memory IC Type | FLASH |
| Temperature Grade | INDUSTRIAL |
| Number of Terminations | 22 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Published | 2017 |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Parallel/Serial | SERIAL |
| Terminal Pitch | 0.4mm |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 33MHz |
| Supply Voltage-Min (Vsup) | 1.65V |
| Memory Density | 67108864 bit |
| Organization | 16MX4 |
| Height Seated (Max) | 0.52mm |
| Additional Feature | ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT |
| JESD-30 Code | R-PBGA-B22 |
*The following components have specifications similar
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