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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Alternate Memory Width | 2 |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Surface Mount | YES |
| Lead Free | Lead Free |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Terminations | 8 |
| Memory Width | 4 |
| Factory Lead Time | 16 Weeks |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Width | 2mm |
| Supply Voltage | 1.8V |
| Programming Voltage | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Part Status | Not For New Designs |
| Memory Format | FLASH |
| Length | 3mm |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Published | 2017 |
| Packaging | Cut Tape (CT) |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Height Seated (Max) | 0.6mm |
| Clock Frequency | 80MHz |
| Interface | SPI, Serial |
| Operating Mode | SYNCHRONOUS |
| Technology | FLASH – NOR |
| Supply Voltage-Min (Vsup) | 1.65V |
| Voltage – Supply | 1.65V~3.6V |
| Memory Density | 16777216 bit |
| Package / Case | 8-UFDFN Exposed Pad |
| Memory Size | 16Mb 2M x 8 |
| Series | MXSMIO? |
| Organization | 4MX4 |
| Write Cycle Time – Word, Page | 100μs, 4ms |
| JESD-30 Code | R-PBCC-B8 |
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