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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Alternate Memory Width | 2 |
Mounting Type | Surface Mount |
Number of Functions | 1 |
RoHS Status | Non-RoHS Compliant |
Surface Mount | YES |
JESD-609 Code | e3 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Terminations | 8 |
Terminal Position | DUAL |
Memory Width | 4 |
Packaging | Tube |
Factory Lead Time | 10 Weeks |
Supply Voltage | 3V |
Programming Voltage | 3V |
Terminal Pitch | 1.27mm |
Terminal Finish | Tin (Sn) |
Operating Temperature | -40°C~85°C TA |
Memory Format | FLASH |
Supply Voltage-Max (Vsup) | 3.6V |
Published | 2017 |
Supply Voltage-Min (Vsup) | 2.7V |
Memory Type | Non-Volatile |
Memory Interface | SPI |
Height Seated (Max) | 2.16mm |
JESD-30 Code | R-PDSO-G8 |
Voltage – Supply | 2.7V~3.6V |
Parallel/Serial | SERIAL |
Operating Mode | SYNCHRONOUS |
Technology | FLASH – NOR |
Clock Frequency | 120MHz |
Package / Case | 8-SOIC (0.209, 5.30mm Width) |
Memory Size | 128Mb 16M x 8 |
Memory Density | 134217728 bit |
Length | 5.28mm |
Organization | 32MX4 |
Width | 5.23mm |
Write Cycle Time – Word, Page | 30μs, 750μs |
Series | MX25xxx45 – MXSMIO? |
Additional Feature | CAN BE ORGANISED AS 128 M X 1 |
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