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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Surface Mount | YES |
Memory Width | 8 |
Packaging | Tray |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Factory Lead Time | 7 Weeks |
Operating Temperature | -40°C~85°C TA |
Terminal Pitch | 1mm |
Number of Terminations | 100 |
Memory Format | FLASH |
Supply Voltage-Max (Vsup) | 3.6V |
Terminal Position | BOTTOM |
Supply Voltage-Min (Vsup) | 2.7V |
Programming Voltage | 2.7V |
Height Seated (Max) | 1.2mm |
JESD-609 Code | e1 |
Memory Type | Non-Volatile |
Width | 14mm |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Voltage – Supply | 2.7V~3.6V |
Length | 18mm |
Operating Mode | SYNCHRONOUS |
Parallel/Serial | PARALLEL |
Technology | FLASH – NAND |
Memory Interface | MMC |
Series | e?MMC? |
Memory Size | 64Gb 8G x 8 |
Organization | 8GX8 |
Memory Density | 68719476736 bit |
Package / Case | 100-TBGA |
JESD-30 Code | R-PBGA-B100 |
*The following components have specifications similar
*The following five components have specifications similar