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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Surface Mount | YES |
| External Data Bus Width | 8 |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Factory Lead Time | 13 Weeks |
| Terminal Pitch | 0.5mm |
| Part Status | Not For New Designs |
| Memory Format | FLASH |
| Terminal Position | BOTTOM |
| JESD-609 Code | e1 |
| Height Seated (Max) | 1.4mm |
| Memory Type | Non-Volatile |
| HTS Code | 8542.31.00.01 |
| Length | 13mm |
| Width | 11.5mm |
| Supply Voltage-Min (Vsup) | 1.65V |
| Terminal Finish | TIN SILVER COPPER |
| Supply Voltage-Max (Vsup) | 1.95V |
| Operating Temperature | -25°C~85°C TA |
| Technology | FLASH – NAND |
| Memory Interface | MMC |
| Number of Terminations | 153 |
| Series | e?MMC? |
| Memory Size | 512Gb 64G x 8 |
| JESD-30 Code | R-PBGA-B153 |
| Package / Case | 153-LFBGA |
| Additional Feature | IT ALSO OPERATES AT 2.7V TO 3.6 V |
| Host Data Transfer Rate-Max | 280 MBps |
*The following components have specifications similar
*The following five components have specifications similar
