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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Packaging | Bulk |
Mounting Type | Surface Mount |
Pbfree Code | yes |
Surface Mount | YES |
Published | 2013 |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Supply Voltage | 1.8V |
Operating Temperature | -40°C~85°C TA |
Terminal Pitch | 0.5mm |
Memory Format | FLASH |
Part Status | Discontinued |
Terminal Position | BOTTOM |
Height Seated (Max) | 0.8mm |
JESD-609 Code | e1 |
Memory Type | Non-Volatile |
HTS Code | 8542.31.00.01 |
Voltage – Supply | 2.7V~3.6V |
Length | 13mm |
Width | 11.5mm |
Terminal Finish | TIN SILVER COPPER |
Technology | FLASH – NAND |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Memory Interface | MMC |
Number of Terminations | 153 |
Pin Count | 153 |
Series | e?MMC? |
Memory Size | 32Gb 4G x 8 |
Package / Case | 153-WFBGA |
JESD-30 Code | R-PBGA-B153 |
Additional Feature | IT ALSO OPERATES AT 3.3 VOLTS |
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