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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Packaging | Bulk |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Surface Mount | YES |
| Part Status | Obsolete |
| Programming Voltage | 3.3V |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 1mm |
| Number of Terminations | 100 |
| Pin Count | 100 |
| Memory Format | FLASH |
| Terminal Position | BOTTOM |
| Published | 2017 |
| JESD-609 Code | e1 |
| Height Seated (Max) | 1.4mm |
| Memory Type | Non-Volatile |
| Width | 14mm |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.31.00.01 |
| Length | 18mm |
| Voltage – Supply | 1.65V~3.6V |
| Technology | FLASH – NAND |
| Memory Interface | MMC |
| Package / Case | 100-LBGA |
| Series | e?MMC? |
| Memory Size | 256Gb 32G x 8 |
| JESD-30 Code | R-PBGA-B100 |
*The following components have specifications similar
*The following five components have specifications similar
