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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
Surface Mount | YES |
Memory Width | 8 |
Supply Voltage | 3.3V |
Programming Voltage | 3.3V |
Packaging | Tray |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Operating Temperature (Max) | 85°C |
Time@Peak Reflow Temperature-Max (s) | 30 |
Factory Lead Time | 7 Weeks |
Terminal Pitch | 0.5mm |
Reach Compliance Code | compliant |
Memory IC Type | FLASH |
Supply Voltage-Max (Vsup) | 3.6V |
Terminal Position | BOTTOM |
Supply Voltage-Min (Vsup) | 2.7V |
Height Seated (Max) | 0.8mm |
Terminal Form | BALL |
Operating Temperature (Min) | -25°C |
JESD-609 Code | e2 |
Length | 13mm |
Temperature Grade | OTHER |
Operating Mode | SYNCHRONOUS |
Parallel/Serial | PARALLEL |
Width | 11.5mm |
Clock Frequency | 52MHz |
Number of Terminations | 153 |
Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
Memory Density | 17179869184 bit |
JESD-30 Code | R-PBGA-B153 |
Organization | 2GX8 |
*The following components have specifications similar
*The following five components have specifications similar