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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
ECCN Code | EAR99 |
Radiation Hardening | No |
Surface Mount | YES |
Packaging | Tray |
JESD-609 Code | e0 |
Technology | CMOS |
Published | 2015 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Memory Width | 9 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Supply Voltage | 1.8V |
Operating Supply Voltage | 1.8V |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Pitch | 1mm |
Part Status | Discontinued |
Terminal Position | BOTTOM |
Memory Interface | Parallel |
Height Seated (Max) | 1.2mm |
Output Characteristics | 3-STATE |
Memory Type | Volatile |
Supply Voltage-Min (Vsup) | 1.7V |
Number of Terminations | 144 |
Number of Pins | 144 |
Pin Count | 144 |
I/O Type | COMMON |
Peak Reflow Temperature (Cel) | 235 |
Supply Voltage-Max (Vsup) | 1.9V |
Memory Format | DRAM |
Max Frequency | 400MHz |
Access Time | 15ns |
Voltage – Supply | 1.7V~1.9V |
Length | 18.5mm |
Data Bus Width | 9b |
Sequential Burst Length | 248 |
Operating Temperature | 0°C~95°C TC |
Package / Case | 144-TFBGA |
HTS Code | 8542.32.00.32 |
Additional Feature | AUTO REFRESH |
Power Supplies | 1.5/1.81.82.5V |
Standby Current-Max | 0.055A |
Address Bus Width | 25b |
Density | 576 Mb |
Memory Size | 576Mb 64M x 9 |
Organization | 64MX9 |
Supply Current-Max | 0.655mA |
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