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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
ECCN Code | EAR99 |
Surface Mount | YES |
Lead Free | Lead Free |
Part Status | Obsolete |
Memory Width | 4 |
Packaging | Tray |
Qualification Status | Not Qualified |
Peak Reflow Temperature (Cel) | 260 |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | 30 |
Supply Voltage | 1.8V |
Operating Supply Voltage | 1.8V |
Published | 2005 |
Interleaved Burst Length | 48 |
Sequential Burst Length | 48 |
Terminal Position | BOTTOM |
Number of Terminations | 60 |
Pin Count | 60 |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
Moisture Sensitivity Level (MSL) | 2 (1 Year) |
Height Seated (Max) | 1.2mm |
JESD-609 Code | e1 |
Output Characteristics | 3-STATE |
Width | 8mm |
Memory Type | Volatile |
Length | 12mm |
Supply Voltage-Min (Vsup) | 1.7V |
Operating Mode | SYNCHRONOUS |
I/O Type | COMMON |
Supply Voltage-Max (Vsup) | 1.9V |
Memory Format | DRAM |
Write Cycle Time – Word, Page | 15ns |
Voltage – Supply | 1.7V~1.9V |
Refresh Cycles | 8192 |
Terminal Finish | TIN SILVER COPPER |
Additional Feature | AUTO/SELF REFRESH |
Standby Current-Max | 0.005A |
Memory Density | 268435456 bit |
Operating Temperature | 0°C~85°C TC |
Technology | SDRAM – DDR2 |
HTS Code | 8542.32.00.24 |
Clock Frequency | 267MHz |
JESD-30 Code | R-PBGA-B60 |
Organization | 64MX4 |
Supply Current-Max | 0.24mA |
Package / Case | 60-FBGA |
Access Time | 500ps |
Memory Size | 256Mb 64M x 4 |
Base Part Number | MT47H64M4 |
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