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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
ECCN Code | EAR99 |
Pbfree Code | yes |
Surface Mount | YES |
Packaging | Tray |
Qualification Status | Not Qualified |
Memory Width | 16 |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Published | 2014 |
Supply Voltage | 1.8V |
Power Supplies | 1.8V |
Factory Lead Time | 9 Weeks |
Interleaved Burst Length | 48 |
Sequential Burst Length | 48 |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
Height Seated (Max) | 1.2mm |
JESD-609 Code | e1 |
Output Characteristics | 3-STATE |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Width | 8mm |
Memory Type | Volatile |
Length | 12.5mm |
Supply Voltage-Min (Vsup) | 1.7V |
Number of Terminations | 84 |
Pin Count | 84 |
Operating Mode | SYNCHRONOUS |
I/O Type | COMMON |
Supply Voltage-Max (Vsup) | 1.9V |
Memory Format | DRAM |
Clock Frequency | 400MHz |
Write Cycle Time – Word, Page | 15ns |
Voltage – Supply | 1.7V~1.9V |
Refresh Cycles | 8192 |
Additional Feature | AUTO/SELF REFRESH |
Standby Current-Max | 0.01A |
Memory Density | 536870912 bit |
Memory Size | 512Mb 32M x 16 |
Technology | SDRAM – DDR2 |
Operating Temperature | -40°C~95°C TC |
Organization | 32MX16 |
HTS Code | 8542.32.00.28 |
Access Time | 400ps |
Package / Case | 84-TFBGA |
JESD-30 Code | R-PBGA-B84 |
Base Part Number | MT47H32M16 |
Supply Current-Max | 0.215mA |
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