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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Packaging | Bulk |
| Mounting Type | Surface Mount |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Factory Lead Time | 10 Weeks |
| Qualification Status | Not Qualified |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Published | 2014 |
| Supply Voltage | 1.8V |
| Power Supplies | 1.8V |
| Memory Width | 32 |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Memory Interface | Parallel |
| Output Characteristics | 3-STATE |
| Memory Type | Volatile |
| I/O Type | COMMON |
| Access Time | 5ns |
| Memory Format | DRAM |
| Refresh Cycles | 8192 |
| Operating Temperature | -25°C~85°C TA |
| Number of Terminations | 168 |
| Standby Current-Max | 0.00001A |
| Voltage – Supply | 1.7V~1.95V |
| Supply Current-Max | 0.09mA |
| Technology | SDRAM – Mobile LPDDR |
| Interleaved Burst Length | 24816 |
| Sequential Burst Length | 24816 |
| Memory Density | 8589934592 bit |
| Memory Size | 8Gb 256M x 32 |
| JESD-30 Code | S-PBGA-B168 |
| Clock Frequency | 208MHz |
| Organization | 256MX32 |
| Write Cycle Time – Word, Page | 14.4ns |
| Package / Case | 168-TFBGA |
*The following components have specifications similar
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