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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Packaging | Bulk |
| Number of Functions | 1 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Factory Lead Time | 6 Weeks |
| Memory Width | 4 |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Operating Temperature (Max) | 105°C |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1.2V |
| Temperature Grade | OTHER |
| Operating Mode | SYNCHRONOUS |
| Height Seated (Max) | 4.2mm |
| Length | 31mm |
| Width | 31mm |
| Supply Voltage-Min (Vsup) | 1.14V |
| HTS Code | 8542.32.00.71 |
| Supply Voltage-Max (Vsup) | 1.26V |
| Number of Terminations | 896 |
| Memory IC Type | MEMORY CIRCUIT |
| JESD-30 Code | S-PBGA-B896 |
| Memory Density | 17179869184 bit |
| Organization | 4GX4 |
*The following components have specifications similar
*The following five components have specifications similar
