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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
ECCN Code | EAR99 |
Radiation Hardening | No |
Lead Free | Lead Free |
Memory Width | 8 |
Interleaved Burst Length | 8 |
Sequential Burst Length | 8 |
Factory Lead Time | 12 Weeks |
Packaging | Tray |
Published | 2012 |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
Height Seated (Max) | 1.2mm |
JESD-609 Code | e1 |
Output Characteristics | 3-STATE |
Memory Type | Volatile |
Data Bus Width | 8b |
Number of Terminations | 78 |
Number of Pins | 78 |
I/O Type | COMMON |
Memory Format | DRAM |
Length | 10.5mm |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Supply Voltage | 1.35V |
Operating Supply Voltage | 1.35V |
Refresh Cycles | 8192 |
Access Time | 20ns |
Address Bus Width | 18b |
Supply Voltage-Max (Vsup) | 1.45V |
Operating Temperature | 0°C~95°C TC |
Technology | SDRAM – DDR3L |
Voltage – Supply | 1.283V~1.45V |
Package / Case | 78-TFBGA |
Clock Frequency | 933MHz |
Supply Voltage-Min (Vsup) | 1.283V |
Memory Size | 2Gb 256M x 8 |
HTS Code | 8542.32.00.36 |
Standby Current-Max | 0.012A |
Organization | 256MX8 |
Density | 2 Gb |
Supply Current-Max | 0.164mA |
Base Part Number | MT41K256M8 |
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