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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Toggle Bit | NO |
Data Polling | NO |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Number of Functions | 1 |
Pbfree Code | yes |
Radiation Hardening | No |
Command User Interface | YES |
Ready/Busy | YES |
Lead Free | Lead Free |
Memory Width | 8 |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Packaging | Tray |
Peak Reflow Temperature (Cel) | 260 |
Ambient Temperature Range High | 85°C |
Published | 2011 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Operating Temperature | -40°C~85°C TA |
Height | 1mm |
Memory Format | FLASH |
Factory Lead Time | 5 Weeks |
Supply Voltage-Max (Vsup) | 3.6V |
Terminal Position | BOTTOM |
Supply Voltage-Min (Vsup) | 2.7V |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
JESD-609 Code | e1 |
Memory Type | Non-Volatile |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Word Size | 8b |
Voltage – Supply | 2.7V~3.6V |
Contact Plating | Copper, Silver, Tin |
Nominal Supply Current | 35mA |
Sync/Async | Asynchronous |
Access Time | 20 ns |
HTS Code | 8542.32.00.51 |
Number of Terminations | 63 |
Number of Pins | 63 |
Pin Count | 63 |
Technology | FLASH – NAND |
Page Size | 2kB |
ECCN Code | 3A991.B.1.A |
Standby Current-Max | 0.0001A |
Address Bus Width | 1b |
Sector Size | 128K |
Package / Case | 63-VFBGA |
Memory Size | 8Gb 1G x 8 |
Organization | 8GX8 |
Density | 8 Gb |
Number of Sectors/Size | 8K |
Base Part Number | MT29F8G08 |
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