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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Packaging | Bulk |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Factory Lead Time | 6 Weeks |
Operating Supply Voltage | 3.3V |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Ambient Temperature Range High | 70°C |
Time@Peak Reflow Temperature-Max (s) | 30 |
Height | 1mm |
Memory Format | FLASH |
Memory Interface | Parallel |
JESD-609 Code | e1 |
Operating Temperature | 0°C~70°C TA |
Memory Type | Non-Volatile |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Word Size | 8b |
Nominal Supply Current | 15mA |
Voltage – Supply | 2.7V~3.6V |
Contact Plating | Copper, Silver, Tin |
Sync/Async | Asynchronous |
Number of Pins | 63 |
Page Size | 4kB |
Technology | FLASH – NAND |
Package / Case | 63-VFBGA |
Memory Size | 4Gb 512M x 8 |
Address Bus Width | 30b |
Density | 4 Gb |
Base Part Number | MT29F4G08 |
*The following components have specifications similar
*The following five components have specifications similar