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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Toggle Bit | NO |
| Data Polling | NO |
| RoHS Status | ROHS3 Compliant |
| Packaging | Bulk |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Command User Interface | YES |
| Ready/Busy | YES |
| Memory Width | 8 |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Voltage – Rated DC | 3.3V |
| Voltage | 3.3V |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Published | 2008 |
| Height Seated (Max) | 1mm |
| Memory Format | FLASH |
| Factory Lead Time | 5 Weeks |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Operating Temperature | 0°C~70°C TA |
| Memory Type | Non-Volatile |
| Word Size | 8b |
| Length | 11mm |
| Voltage – Supply | 2.7V~3.6V |
| Contact Plating | Copper, Silver, Tin |
| Nominal Supply Current | 35mA |
| Sync/Async | Asynchronous |
| Access Time (Max) | 25 ns |
| Number of Terminations | 63 |
| Number of Pins | 63 |
| Technology | FLASH – NAND |
| Page Size | 2kB |
| Number of Sectors/Size | 2K |
| Standby Current-Max | 0.0001A |
| Sector Size | 128K |
| Package / Case | 63-VFBGA |
| Memory Size | 2Gb 256M x 8 |
| Organization | 256MX8 |
| Density | 2 Gb |
| Address Bus Width | 29b |
| Base Part Number | MT29F2G08 |
*The following components have specifications similar
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