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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Memory Width | 1 |
| Surface Mount | YES |
| Factory Lead Time | 3 Weeks |
| Part Status | Obsolete |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Packaging | Tray |
| Published | 2013 |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Operating Temperature | -40°C~85°C TA |
| Height Seated (Max) | 1mm |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Supply Voltage-Min (Vsup) | 2.7V |
| Programming Voltage | 2.7V |
| Terminal Pitch | 0.8mm |
| JESD-609 Code | e1 |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Clock Frequency | 50MHz |
| Width | 9mm |
| Length | 11mm |
| Voltage – Supply | 2.7V~3.6V |
| Interface | SPI, Serial |
| Operating Mode | SYNCHRONOUS |
| HTS Code | 8542.32.00.51 |
| Number of Terminations | 63 |
| Number of Pins | 63 |
| Terminal Finish | TIN SILVER COPPER |
| Technology | FLASH – NAND |
| ECCN Code | 3A991.B.1.A |
| Memory Density | 2147483648 bit |
| Package / Case | 63-VFBGA |
| Memory Size | 2Gb 2G x 1 |
| Organization | 2GX1 |
| Base Part Number | MT29F2G01 |
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