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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| JESD-609 Code | e3 |
| Contact Plating | Tin |
| Memory Width | 8 |
| Terminal Position | DUAL |
| Factory Lead Time | 6 Weeks |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Packaging | Tray |
| Published | 2013 |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Memory Format | FLASH |
| Number of Terminations | 48 |
| Number of Pins | 48 |
| Pin Count | 48 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Programming Voltage | 2.7V |
| Memory Interface | Parallel |
| Nominal Supply Current | 50mA |
| Height Seated (Max) | 1.2mm |
| Memory Type | Non-Volatile |
| Word Size | 8b |
| Voltage – Supply | 2.7V~3.6V |
| Sync/Async | Asynchronous |
| Page Size | 4kB |
| Length | 18.4mm |
| Technology | FLASH – NAND |
| Package / Case | 48-TFSOP (0.724, 18.40mm Width) |
| Address Bus Width | 1b |
| Memory Size | 16Gb 2G x 8 |
| Density | 16 Gb |
| Organization | 2GX8 |
| Base Part Number | MT29F16G08 |
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