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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Surface Mount | YES |
Memory Width | 8 |
Packaging | Tray |
Operating Temperature (Min) | -40°C |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Operating Temperature (Max) | 85°C |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Published | 2014 |
Factory Lead Time | 7 Weeks |
Supply Voltage | 1.8V |
Height Seated (Max) | 1mm |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Terminal Form | BALL |
JESD-609 Code | e1 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Supply Voltage-Min (Vsup) | 1.7V |
Length | 13mm |
Operating Mode | SYNCHRONOUS |
Width | 10.5mm |
Supply Voltage-Max (Vsup) | 1.95V |
HTS Code | 8542.32.00.71 |
Memory Density | 4294967296 bit |
Memory IC Type | MEMORY CIRCUIT |
Organization | 512MX8 |
Number of Terminations | 137 |
Package / Case | 137-VFBGA |
JESD-30 Code | R-PBGA-B137 |
Additional Feature | IT IS ALSO HAVING 2GBIT (X 32) LPDDR |
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