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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Packaging | Tape & Reel (TR) |
Number of Functions | 1 |
Surface Mount | YES |
Part Status | Obsolete |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Qualification Status | Not Qualified |
JESD-609 Code | e0 |
Technology | CMOS |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Supply Voltage | 1.8V |
Operating Supply Voltage | 1.8V |
Reach Compliance Code | not_compliant |
Terminal Finish | Tin/Lead (Sn/Pb) |
Operating Temperature | -40°C~85°C TA |
Memory Format | FLASH |
Terminal Position | BOTTOM |
Memory Interface | Parallel |
Memory Type | Non-Volatile |
Width | 8mm |
Height | 1.1mm |
Number of Pins | 66 |
Number of Terminations | 66 |
Pin Count | 66 |
Length | 12mm |
Supply Voltage-Max (Vsup) | 2.2V |
Operating Mode | ASYNCHRONOUS |
Supply Voltage-Min (Vsup) | 1.65V |
HTS Code | 8542.32.00.71 |
Access Time | 100ns |
Standby Current-Max | 0.00001A |
Memory Density | 33554432 bit |
Organization | 2MX16 |
Subcategory | Other Memory ICs |
Memory Size | 32Mb 2M x 16 |
Voltage – Supply | 1.65V~2.2V |
Power Supplies | 1.8/2V |
Supply Current-Max | 0.026mA |
Package / Case | 66-LFBGA |
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