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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | RoHS Compliant |
Surface Mount | YES |
Part Status | Obsolete |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Packaging | Tray |
Qualification Status | Not Qualified |
Technology | CMOS |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Published | 2009 |
Terminal Pitch | 1mm |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Height Seated (Max) | 2.9mm |
Supply Voltage | 1.2V |
Power Supplies | 1.2V |
Length | 35mm |
Width | 35mm |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Subcategory | Field Programmable Gate Arrays |
Core Architecture | ARM |
Frequency | 166MHz |
RAM Size | 64kB |
Architecture | MCU, FPGA |
Supply Voltage-Min (Vsup) | 1.14V |
Supply Voltage-Max (Vsup) | 1.26V |
Package / Case | 1152-BBGA, FCBGA |
JESD-30 Code | S-PBGA-B1152 |
Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Peripherals | DDR, PCIe, SERDES |
Flash Size | 512KB |
Number of I/O | 574 |
Number of Outputs | 574 |
Number of Inputs | 574 |
Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
Number of Logic Cells | 99512 |
Primary Attributes | FPGA – 100K Logic Modules |
Core Processor | ARM?? Cortex??-M3 |
Base Part Number | M2S100 |
Operating Temperature | -40?ˉC~100?ˉC TJ |
Series | SmartFusion??2 |
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