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In Stock: 500

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusNon-RoHS Compliant
PackagingTray
Factory Lead Time10 Weeks
Published2015
Moisture Sensitivity Level (MSL)3 (168 Hours)
Speed166MHz
Operating Temperature-40°C~100°C TJ
RAM Size64kB
Core ProcessorARM? Cortex?-M3
Lifecycle StatusIN PRODUCTION (Last Updated: 2 weeks ago)
ArchitectureMCU, FPGA
Flash Size256KB
ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
SeriesSmartFusion?2
PeripheralsDDR, PCIe, SERDES
Package / Case676-BGA
Supplier Device Package676-FBGA (27×27)
Primary AttributesFPGA – 60K Logic Modules
Number of I/O387

Manufacturer introduction

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