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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | Non-RoHS Compliant |
| Part Status | Obsolete |
| Packaging | Tray |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85°C |
| Published | 2015 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Factory Lead Time | 5 Weeks |
| Min Operating Temperature | 0°C |
| Operating Supply Voltage | 1.2V |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Operating Temperature | 0°C~85°C TJ |
| Speed | 166MHz |
| Max Frequency | 400MHz |
| RAM Size | 64kB |
| Core Processor | ARM? Cortex?-M3 |
| Memory Size | 256kB |
| Architecture | MCU, FPGA |
| Flash Size | 256KB |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Series | SmartFusion?2 |
| Peripherals | DDR, PCIe, SERDES |
| Package / Case | 896-BGA |
| Number of I/O | 377 |
| Number of Logic Elements/Cells | 56340 |
| Primary Attributes | FPGA – 50K Logic Modules |
| Supplier Device Package | 896-FBGA (31×31) |
| Base Part Number | M2S050 |
| Data Rate | 667 Mbps |
| Number of Logic Blocks (LABs) | 4695 |
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