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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | Non-RoHS Compliant |
Packaging | Tray |
Max Operating Temperature | 85°C |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Published | 2009 |
Factory Lead Time | 11 Weeks |
Min Operating Temperature | 0°C |
Operating Supply Voltage | 1.2V |
Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
Core Architecture | ARM |
Operating Temperature | 0°C~85°C TJ |
Frequency | 166MHz |
Speed | 166MHz |
Max Frequency | 400MHz |
Number of Pins | 484 |
RAM Size | 64kB |
Memory Size | 128kB |
Core Processor | ARM? Cortex?-M3 |
Architecture | MCU, FPGA |
Package / Case | 484-BGA |
Number of I/O | 209 |
Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Series | SmartFusion?2 |
Supplier Device Package | 484-FPBGA (23×23) |
Peripherals | DDR |
Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
Flash Size | 128KB |
Number of Logic Blocks (LABs) | 505 |
Number of Logic Elements/Cells | 6060 |
Primary Attributes | FPGA – 5K Logic Modules |
Base Part Number | M2S005 |
Data Rate | 667 Mbps |
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