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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| Command User Interface | YES |
| Data Polling | YES |
| Toggle Bit | YES |
| Ready/Busy | YES |
| Common Flash Interface | YES |
| Lead Free | Lead Free |
| Part Status | Obsolete |
| Alternate Memory Width | 8 |
| Packaging | Tray |
| Memory Width | 16 |
| Termination | SMD/SMT |
| REACH SVHC | No SVHC |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 3V |
| Published | 2009 |
| Operating Temperature | -40°C~85°C TA |
| Memory Format | FLASH |
| Number of Terminations | 48 |
| Number of Pins | 48 |
| Pin Count | 48 |
| Terminal Position | BOTTOM |
| Voltage | 2.7V |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| JESD-609 Code | e1 |
| Width | 6mm |
| Nominal Supply Current | 10mA |
| Memory Type | Non-Volatile |
| Length | 8mm |
| Voltage – Supply | 2.7V~3.6V |
| Contact Plating | Copper, Silver, Tin |
| Sync/Async | Asynchronous |
| Technology | FLASH – NOR |
| HTS Code | 8542.32.00.51 |
| Power Supplies | 3/3.3V |
| Access Time (Max) | 70 ns |
| Write Cycle Time – Word, Page | 70ns |
| ECCN Code | 3A991.B.1.A |
| Standby Current-Max | 0.0001A |
| Boot Block | TOP |
| Package / Case | 48-TFBGA |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
| Organization | 2MX16 |
| Density | 32 Mb |
| Memory Size | 32Mb 4M x 8 2M x 16 |
| Additional Feature | TOP BOOT BLOCK |
| Sector Size | 8K64K |
| Number of Sectors/Size | 863 |
| Base Part Number | M29W320 |
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