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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Number of Terminations | 8 |
| Memory Width | 8 |
| Terminal Position | DUAL |
| Factory Lead Time | 8 Weeks |
| Technology | CMOS |
| Supply Voltage | 2.5V |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Terminal Pitch | 1.27mm |
| Terminal Finish | Tin (Sn) |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Programming Voltage | 2.7V |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Width | 3.9mm |
| Height Seated (Max) | 1.75mm |
| Length | 4.9mm |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Operating Temperature | -40°C~105°C TA |
| JESD-30 Code | R-PDSO-G8 |
| Clock Frequency | 30MHz |
| Supply Voltage-Min (Vsup) | 2.3V |
| Write Cycle Time – Word, Page | 5ms |
| Interface | SPI, Serial |
| Operating Mode | SYNCHRONOUS |
| Voltage – Supply | 2.3V~3.6V |
| Memory Size | 4Mb 512K x 8 |
| Memory Density | 4194304 bit |
| Organization | 512KX8 |
*The following components have specifications similar
*The following five components have specifications similar
