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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Mounting Type | Surface Mount |
Packaging | Tape & Reel (TR) |
Number of Functions | 1 |
Pbfree Code | yes |
Surface Mount | YES |
Lead Free | Lead Free |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Memory Width | 8 |
Published | 2013 |
Number of Terminations | 6 |
Technology | CMOS |
Operating Temperature | -40°C~85°C TA |
Supply Voltage-Max (Vsup) | 3.6V |
Supply Voltage | 2V |
Terminal Position | BOTTOM |
Width | 0.8mm |
Length | 1.2mm |
Lifecycle Status | ACTIVE (Last Updated: 1 week ago) |
Memory Type | Non-Volatile |
Memory Interface | I2C |
Serial Bus Type | I2C |
Clock Frequency | 1MHz |
Supply Voltage-Min (Vsup) | 1.7V |
Factory Lead Time | 34 Weeks |
Memory Format | EEPROM |
Parallel/Serial | SERIAL |
Terminal Pitch | 0.4mm |
Write Cycle Time – Word, Page | 5ms |
Write Cycle Time-Max (tWC) | 5ms |
Operating Mode | SYNCHRONOUS |
Voltage – Supply | 1.7V~3.6V |
Height Seated (Max) | 0.33mm |
Memory Size | 16Kb 2K x 8 |
Organization | 2KX8 |
Memory Density | 16384 bit |
Access Time | 450ns |
JESD-30 Code | R-PBGA-B6 |
Package / Case | 6-XFBGA, WLCSP |
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