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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Surface Mount | YES |
| Memory Width | 8 |
| Supply Voltage | 3.3V |
| Packaging | Tray |
| Factory Lead Time | 10 Weeks |
| Qualification Status | Not Qualified |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage-Max (Vsup) | 3.6V |
| Standby Voltage-Min | 2V |
| Terminal Position | BOTTOM |
| Number of Pins | 36 |
| Number of Terminations | 36 |
| Pin Count | 36 |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| JESD-609 Code | e1 |
| Width | 6mm |
| Operating Temperature | -40°C~125°C TA |
| Output Characteristics | 3-STATE |
| Length | 8mm |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Screening Level | AEC-Q100 |
| Write Cycle Time – Word, Page | 10ns |
| I/O Type | COMMON |
| Access Time (Max) | 10 ns |
| Supply Voltage-Min (Vsup) | 2.4V |
| Power Supplies | 2.5/3.3V |
| Technology | SRAM – Asynchronous |
| Terminal Finish | TIN SILVER COPPER |
| HTS Code | 8542.32.00.41 |
| Additional Feature | PIPELINED ARCHITECTURE |
| ECCN Code | 3A991.B.2.A |
| Supply Current-Max | 0.05mA |
| Terminal Pitch | 0.75mm |
| Standby Current-Max | 0.015A |
| Voltage – Supply | 2.4V~3.6V |
| Memory Size | 2Mb 256K x 8 |
| Memory Density | 2097152 bit |
| Organization | 256KX8 |
| Package / Case | 36-TFBGA |
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