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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Surface Mount | YES |
| Memory Width | 8 |
| Factory Lead Time | 8 Weeks |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 3V |
| Operating Temperature | -40°C~85°C TA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Number of Terminations | 36 |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| JESD-609 Code | e1 |
| Width | 6mm |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Length | 8mm |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Supply Voltage-Min (Vsup) | 2.2V |
| Technology | SRAM – Asynchronous |
| HTS Code | 8542.32.00.41 |
| Access Time (Max) | 45 ns |
| Write Cycle Time – Word, Page | 45ns |
| Terminal Pitch | 0.75mm |
| Voltage – Supply | 2.2V~3.6V |
| Memory Size | 2Mb 256K x 8 |
| Memory Density | 2097152 bit |
| Organization | 256KX8 |
| Package / Case | 36-TFBGA |
| JESD-30 Code | R-PBGA-B36 |
*The following components have specifications similar
*The following five components have specifications similar
