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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Pbfree Code | yes |
Radiation Hardening | No |
Surface Mount | YES |
Number of Ports | 8 |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Packaging | Tray |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Operating Temperature | -40°C~85°C TA |
Terminal Pitch | 1mm |
Terminal Position | BOTTOM |
Memory Interface | Parallel |
Moisture Sensitivity Level (MSL) | 2 (1 Year) |
JESD-609 Code | e1 |
Memory Width | 72 |
Output Characteristics | 3-STATE |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Memory Type | Volatile |
Clock Frequency | 200MHz |
Nominal Supply Current | 600mA |
Memory Format | SRAM |
Voltage – Supply | 3.135V~3.465V |
Length | 22mm |
Sync/Async | Synchronous |
I/O Type | COMMON |
Supply Voltage-Max (Vsup) | 3.465V |
Supply Voltage-Min (Vsup) | 3.135V |
Address Bus Width | 18b |
Height Seated (Max) | 1.95mm |
Additional Feature | PIPELINED ARCHITECTURE |
ECCN Code | 3A991.B.2.A |
Technology | SRAM – Synchronous, SDR |
Standby Current-Max | 0.075A |
Standby Voltage-Min | 3.14V |
Number of Terminations | 209 |
Number of Pins | 209 |
Pin Count | 209 |
Density | 18 Mb |
Word Size | 72b |
Access Time | 3.1ns |
Package / Case | 209-BGA |
Memory Size | 18Mb 256K x 72 |
Organization | 256KX72 |
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