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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Pbfree Code | yes |
Radiation Hardening | No |
Surface Mount | YES |
JESD-609 Code | e3 |
Factory Lead Time | 12 Weeks |
Number of Ports | 4 |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Packaging | Tray |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Height Seated (Max) | 1.6mm |
Operating Temperature | -40°C~85°C TA |
Terminal Position | QUAD |
Number of Terminations | 100 |
Number of Pins | 100 |
Pin Count | 100 |
Terminal Pitch | 0.65mm |
Memory Width | 36 |
Memory Interface | Parallel |
Moisture Sensitivity Level (MSL) | 2 (1 Year) |
Output Characteristics | 3-STATE |
Length | 20mm |
Memory Type | Volatile |
Terminal Finish | Matte Tin (Sn) – annealed |
Memory Format | SRAM |
Voltage – Supply | 3.135V~3.465V |
Package / Case | 100-LQFP |
Sync/Async | Synchronous |
I/O Type | COMMON |
Supply Voltage-Min (Vsup) | 3.135V |
Standby Current-Max | 0.05A |
Address Bus Width | 18b |
ECCN Code | 3A991.B.2.A |
Technology | SRAM – Synchronous, SDR |
Nominal Supply Current | 280mA |
Word Size | 36b |
Access Time | 7.5ns |
Density | 9 Mb |
Memory Size | 9Mb 256K x 36 |
Additional Feature | FLOW-THROUGH ARCHITECTURE |
Organization | 256KX36 |
Clock Frequency | 117MHz |
*The following components have specifications similar
*The following five components have specifications similar